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FR4 double sided pcb Prototyping pcb board For robot intelligence device

Accuracy Electronics Technologies Co.,Ltd

FR4 double sided pcb Prototyping pcb board For robot intelligence device

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Brand Name : ACCPCB

Model Number : P1042

Certification : ISO,SGS,TS16949

Place of Origin : China

MOQ : 1 PCS

Price : Negotiable

Payment Terms : T/T ,Western Union,Paypal

Supply Ability : 50000SQ.M/Per Month

Delivery Time : 3-5days

Packaging Details : Vacuum packing

Material : FR4

Count : 2layer

Surface Finish : Immersion gold

Usage : Electronic intelligence

Solder Mask : Blue

Service : Customize

Base material : FR-4

Min. hole size : 0.1mm

Copper thickness : 1/2OZ 1OZ 2OZ 3OZ

Min. line spacing : 0.1mm4mil)

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FR4 double sided pcb Prototyping pcb board For robot intelligence device

Production description :

this board is double sides pcb. it is used forrobot ingelligence device . we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

Key Specifications/Special Features:

Number of layers:

Double sides

Base material:

FR4

Copper thickness:

2 / 2 oz Cu

Thickness:

1.58 mm

Size:

80.6 x 90.5 mm

Cooper In holes:

min 20um

Surface finishing:

immersion gold ( au:2u'')

Solder mask:

Blue

Outline: Routing,V-Groove, Beveling punch
Company type: Manufacturer/ Factory
Min line width/space: 0.10mm / 0.10mm
outline profile : punching, routing, punching+push back
outline tolerance +/-10%
Twist and bow: no more than 0.75%
Impedance control: +/-10%

PCB Flow Chart.pdf

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

Products Application:

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

5, Vehicle Electronices: Car etc;

6, Military & Defense : Military Weapons etc;

  • FR4 double sided pcb Prototyping pcb board For robot intelligence device

FAQ:

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


5. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

6. How to you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.


Product Tags:

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